In the ALLEGRO project, packaging plays a crucial role in ensuring optimal performance and integration of our advanced photonic and electronic devices. As detailed in the RP1 Technical Report, Fraunhofer IZM has collaborated closely with IPR, TUe, NVIDIA, and ETHZ to develop tailored packaging solutions for our demonstrators.
One key highlight is the Waveguide Mesh Packaging Approach:
✔️ Flip-Chip on Si Interposer – Designed to manage the high complexity and dense bump array of the IPRonics chip.
✔️ Fan-Out Architecture – The Si interposer fans out the IPR chip’s 60µm pad pitch to a more relaxed 500µm pitch for PCB assembly.
✔️ Integrated Electrical & Optical Connectivity – The sub-assembly is flip-chip mounted onto the PCB, linking seamlessly to the control electronics, while optical connectivity is ensured via a fiber array attachment.
By leveraging cutting-edge packaging techniques, we are paving the way for scalable and high-performance photonic systems.
Looking forward to sharing more updates as we progress! 🚀
#ALLEGRO #Photonics #Semiconductors #Packaging #Innovation #FraunhoferIZM #FlipChip #SiInterposer
